Some of the challenges of designing high speed backplane connectors are:

•  Achieving optimal trade-off between the insertion force and the contact resistance of the connector contact pairs, which affect the mechanical and electrical performance of the connector;

•  Maintaining low insertion loss and high signal integrity at high frequencies and data rates, which require careful consideration of the connector geometry, material, impedance, crosstalk, skew, etc.;

•  Supporting high density and compactness of PCBs in a backplane system, which impose constraints on the connector size, shape, and orientation;

•  Adapting to different signaling standards and frequencies, such as Ethernet, PCI Express, InfiniBand, etc., which have different requirements for the connector performance and compatibility.