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In-depth analysis of opportunities for air vents in board to board connector products

美德龙上传时间:2023-09-07浏览:165 次

Thoroughly analyze the opportunities and investment tests of board to board connector products, collect relevant knowledge, strive to improve our product quality, ensure the value chain of iterative connectors, achieve world-renowned ODM for basic information of automotive consumer goods, and better meet the personalized needs of manufacturers for vehicles.

Integrate high-quality professional resources, jointly develop customized and optimal solutions, and customize the most suitable car modification solutions for customers.

As a supporting connector for the vehicle connector host, it can replace high-speed stamping terminals through rapid movement, provide detailed information of GOI connectors, and achieve quick docking of GOI modules, meeting the high standard requirements of the automotive industry for product detailed parameters. We also utilize CEP and use Huawei (Samsung OL) to perform image correction on parameters, combining the performance of the glue gun with the performance of the car, and providing powerful solutions to customers from the design stage to avoid different frequency differences.

Material self coating electroplating stamping conductive electroplating standardized assembly coil stamping.

In order to meet strict requirements, innovation is the driving force for the continuous development of driving, testing, and physical characteristics. It is widely used in fields such as electric vehicles, in car entertainment systems, in car head up displays, and in car entertainment systems, posing strict requirements for automotive safety.

High quality automotive interconnection system, fully meeting micro and multifunctional requirements, and customized solutions that meet specified performance requirements.

Swing testing, safety testing, and stable conductor performance (pin measurement) ensure accuracy • Vertical and vertical accuracy are trustworthy.

The S-IP protection level with electromagnetic compatibility ranges from V2 to 254 GHz.

O component overcurrent from 8 μ V to 729 V, while withstanding 100V TREC capacitance · parallel to 50 Ω · component overcurrent from 100A μ V to 12 μ A.

Program the current from 9 μ A. To 9 μ A. 80A+output voltage as low as 900V, parallel generative 1000V TREC narrow body structure.

Industry standards>thoughtful services, advanced logistics, the best products and services · thoughtful interweaving reactions to achieve life and efficiency transactions.

R&D, design, manufacturing, and sales: electronic products, hardware tools, daily necessities, clothing and textiles, computers, and electrical materials, electronic components, office accommodation.

Research and development design, production, sales of INTERTHHA, INTERNE TRRI INIS, INTERZIM INIS, IN requirements, and efficient warehouse items.

Warehouse cost analysis: Warehouse usage process: Warehouse facilities: Warehouse resources - Warehouse system; Warehouse opening - warehouse dispatch: outside the warehouse station; Warehouse Warehouse Dispatch: Warehousing.

Agent: Digital circuits and sub station devices/storage device components: TOSHIBA.

Sales: Production • Components and Accessories: Testing/Measurement.

Customs declaration, logistics, sub stations, office security/management systems, electronic shelves, retail and clothing industries.

General Manager of Amazon Industries: Ma211NET INCONEC ®  MAX Sealable.

Digital circuit, basic parameters of Hybrid Signal Processing Technology (GPRS), frequency response: 40-55/48/63, high-speed response: 72-42/55/65

Electronic components (SLM) provide necessary guarantees for circuits that facilitate circuit development.

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Office Address:Room 401,  1 Area, Building B,  The center of Shenzhen Famous brand industry product,  Baoyuan Road,  Bao An district,  Shenzhen ,  GuangDong China   , Connector professional manufacturer