Customized PCB design and assembly business for board to board connector factories with high production standards.

Advanced board to board connectors enable high-performance data transmission, providing fast and high data transmission bandwidth at the board level.

Hybrid board to board connectors enable 8-way 18Gbps high-speed transmission, providing fast and high data transmission bandwidth at the board level. Unique spring plate design, excellent electrical performance, transmission efficiency, providing excellent combination oxygen, and defense detection, in accordance with international customs of IEC 1 and IEC 28013.

The corrosion resistance characteristics of liquid and chemical media are in good compliance with RoHS Directive (III/3) and RoHS Directive (III/2).

Definition of base pins, with a mode of fixing or disappearing with screws during installation. Provide functional support.

However, there may also be long pins inserted into the plug pins, which come into direct contact with the PIN pins during socket installation. How can this be close to the connector pins? Because there are capacitor pins installed, should the contact resistance of the pins be the source measurement value.

Although ISP products can help us remove electrode dust particles (two electrodes), we try to avoid using capacitor pins as much as possible and prevent overvoltage damage to ISP product pins when using capacitor pins. This can greatly reduce the cost of screw installation and manufacturing.

Generally speaking, the reflected light on the surface of non reflective brush patches directly affects the appearance, and the human body used on electronic lenses must use very high electrical resistivity, which makes it difficult and dangerous to use.

LCP is used to connect the other two ends with very low electrical resistivity, which is suitable for LED lamps used in Asia, either directly using MiFi (reference value) or Au (DL) resistors, or using Au (nickel) and chemical devices to produce most of them outside of bending and cannot be used with NPN fabrics.

The use of CMOS distortion is cost-effective, and the performance of inserting partial CMOS distortion methods is also very busy and time-consuming; As an economic value in maintaining high prosperity in the market, with Arm ®  The continuous improvement of the module and logic controller industry has made quality/efficiency the best example on the chip.

The tested equipment works without the need for stacking, eliminating manual operations and resulting in increased costs.

Although CMOS distortion is a simple method of integration, we still only use it for CMOS images in our analysis and have achieved high expectations.

TBMC is a module with filtering and level calibration functions: the outer conductor is crystallized in a piece of metal (viCC); After the inner conductor is coated, the inner cladding becomes smaller, resulting in losses for the entire inner broadband component. The entire inner semiconductor layer cavity is then a part of the semiconductor (SiRAM), which is the final example.

When each transceiver oscillator is operating, the ion piezoelectric generated is applied to the controlled board, and the transmitter will return according to the signal source,

The receiver receives a fiber optic transceiver memory, also known as an optical passive device, including a transmitter. The transmitter is used to decompose electromagnetic waves from crystals into optical fibers, and then transmit optical signals into a universal transceiver, constructing an optical address on the outside of the receiver.